Published September 1992
by International Electronics Packaging Society, .
Written in English
|The Physical Object|
Title International Conference on Electronics Packaging (ICEP ) Desc:Proceedings of a meeting held April , Yamagata, Japan. Prod#:CFPU-POD ISBN Pages (1 Vol) Format:Softcover Notes: Authorized distributor of all IEEE proceedings TOC:View Table of Contents Publ:Institute of Electrical and Electronics Engineers (IEEE) . International Conference on Electronics Packaging (ICEP ) Date: April , Venue: The National Museum of Emerging Science and Innovation, Tokyo. Proceedings of the International Symposium on Microelectronics: October , , Moscone Center, San Francisco, California by San Francisco, Calif.) International Symposium on Microelectronics ( (Book). The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.
Toyama, Japan April IEEE Catalog Number: ISBN: CFPU-POD International Conference on Electronics Packaging. Conference Proceedings: Apics 35th International Conference and Exhibition, October , , Montreal, Canada (ANNUAL INTERNATIONAL PRODUCTION AND INVENTORY CONTROL SOCIETY)) on *FREE* shipping on qualifying offers. Conference Proceedings: Apics 35th International Conference and Exhibition, October , , Montreal. Yamagata, Japan April IEEE Catalog Number: ISBN: CFPU-POD International Conference on Electronics Packaging. National Electronic Packaging and Production Conference (NEPCON) West '94 Proceedings of the Technical Program [Barry Ross et al] on *FREE* shipping on qualifying offers. National Electronic Packaging and Production Conference (NEPCON) West '94 Proceedings of the Technical Program.
Find many great new & used options and get the best deals for Springer Series in Chemical Physics: Ultrafast Phenomena VIII: Proceedings of the 8th International Conference, Antibes Juan-Les-Pins, France, June 55 (, Paperback) at the best online prices at eBay! Free shipping for many products! This is an authoritative reference source of practical information on the materials and processes of microelectronic packaging. Its articles offer the collective knowledge, wisdom, and judgment of expert microelectronics packaging authors, co-authors, and reviewers. The research outcomes of Dr Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 3 books and 9 book chapters. Due to his technical contributions, Dr Lee received many . To date Prof Tay has published more than technical papers, 11 keynote presentations at international conferences, 11 invited lectures, 3 panel discussions, written 3 book chapters and co-edited 4 conference proceedings and two special issues of technical journals.